This paper presents a content-addressable memory (CAM) using a phase-change device. A hierarchical match-line structure and a one-hot-spot block code are indispensable to suppress the resistance ratio of the phase-change device and the area overhead of match detectors. As a result, an 8-nsec 72-bit-parallel-search CAM is implemented using a phase-change-device/MOS-hybrid circuitry, where high and low resistances are higher than 2.3 MΩ and lower than 97 kΩ, respectively, while maintaining one-day retention.

This paper presents a high-speed 5454-bit multiplier using fully differential-pair circuits (DPCs) in 0.18 µm CMOS. The DPC is a key component in maintaining an input signal-voltage swing of 0.2 V while providing a large current-driving capability. The combination of the DPC and the multiple-valued current-mode linear summation makes the critical path shortened and transistor counts reduced. The multiplier has an estimated multiply time of 1.88 ns with 74.2 mW at 400 MHz from a 1.8 V supply occupying a 0.85 mm2 active area.

A new multiple-valued current-mode (MVCM) integrated circuit using a switched current-source control technique is proposed for a 1.5 V-supply high-speed arithmetic circuit with low-power dissipation. The use of a differential logic circuit (DLC) with a pair of dual-rail inputs makes the input voltage swing small, which results in a high driving capability at a lower supply voltage, while having large static power dissipation. In the proposed DLC using a switched current control technique, the static power dissipation can be greatly reduced because current sources in non-active circuit blocks are turned off. Since the gate of each current source is directly controlled by using a multiphase clock whose technique has been already used in dynamic circuit design, no additional transistors are required for currentsource control. As a typical example of arithmetic circuits, a new 1.5 V-supply 5454-bit multiplier based on a 0.8µm standard CMOS technology is also designed. Its performance is about 1.3 times faster than that of a binary fastest multiplier under the normalized power dissipation. A prototype chip is also fabricated to confirm the basic operation of the proposed MVCM integrated circuit.

This paper presents a high-throughput bit-serial low-density parity-check (LDPC) decoder that uses an asynchronous interleaver. Since consecutive log-likelihood message values on the interleaver are similar, node computations are continuously performed by using the most recently arrived messages without significantly affecting bit-error rate (BER) performance. In the asynchronous interleaver, each message's arrival rate is based on the delay due to the wire length, so that the decoding throughput is not restricted by the worst-case latency, which results in a higher average rate of computation. Moreover, the use of a multiple-valued data representation makes it possible to multiplex control signals and data from mutual nodes, thus minimizing the number of handshaking steps in the asynchronous interleaver and eliminating the clock signal entirely. As a result, the decoding throughput becomes 1.3 times faster than that of a bit-serial synchronous decoder under a 90 nm CMOS technology, at a comparable BER.

This paper introduces a partially parallel inter-chip link architecture for asynchronous multi-chip Network-on-Chips (NoCs). The multi-chip NoCs that operate as a large NoC have been recently proposed for very large systems, such as automotive applications. Inter-chip links are key elements to realize high-performance multi-chip NoCs using a limited number of I/Os. The proposed asynchronous link based on level-encoded dual-rail (LEDR) encoding transmits several bits in parallel that are received by detecting the phase information of the LEDR signals at each serial link. It employs a burst-mode data transmission that eliminates a per-bit handshake for a high-speed operation, but the elimination may cause data-transmission errors due to cross-talk and power-supply noises. For triggering data retransmission, errors are detected from the embedded phase information; error-detection codes are not used. The throughput is theoretically modelled and is optimized by considering the bit-error rate (BER) of the link. Using delay parameters estimated for a 0.13 µm CMOS technology, the throughput of 8.82 Gbps is achieved by using 10 I/Os, which is 90.5% higher than that of a link using 9 I/Os without an error-detection method operating under negligible low BER (<10-20).

This paper presents a design of an asynchronous peer-to-peer half-duplex/full-duplex-selectable data-transfer system on-chip interconnected. The data-transfer method between channels is based on a 1-phase signaling scheme realized by using multiple-valued current-mode (MVCM) circuits and encoding, which performs high-speed communication. A data transmission is selectable by adding a mode-detection circuit that observes data-transmission modes; full-duplex, half-duplex and standby modes. Especially, since current sources are completely cut off during the standby mode, the power dissipation can be greatly reduced. Moreover, both half-duplex and full-duplex communication can be realized by sharing a common circuit except a signal-level conversion circuit. The proposed interface is implemented using 0.18-µm CMOS, and its performance improvement is discussed in comparison with those of the other ordinary asynchronous methods.

This paper presents a low-power 8-valued cellular array VLSI for high-speed image processing based on logical neighborhood operations with 33 windows. This array is useful for performing low-level image processing such as noise removal and edge detection, in intelligent integrated systems where immediate response to input change as well as high throughput is needed. In order to achieve high-speed image processing, template matching for neighborhood operations can be performed in parallel on each row. Each row of the image is operated in a pipelining manner. The direct 8-valued encoding of the matched results for three different 33 masks makes it possible to reduce the number of operations by one-third. In the hardware implementation, the matching cell for logical neighborhood operations can be implemented compactly using MOS transistors with different threshold voltage, which are programmed by multiple ion implants. Moreover, a new literal circuit for detecting multiple-valued signals using a dynamic design style eliminates hazards due to timing skews in the difference of various input voltage levels, so that the dynamic power dissipation of the proposed circuit is greatly reduced. Finally, it is demonstrated that the processing time of the proposed cellular array is reduced to about 40 percent in comparison with that of a corresponding binary circuit when power dissipation/area = 0.3 W/100 mm2.

This paper presents a design of a new multiple-valued matching VLSI processor for high-speed reasoning. It is useful in the application for real-time rule-based systems with large knowledge bases which are programmable. In order to realize high-speed reasoning, the matching VLSI processor can perform the fully parallel pattern matching between an input data and rules. On the based of direct multiple-valued encoding of each attribute in an input data and rules, pattern matching can be described by using only a programmable delta literal. Moreover, the programmable delta literal circuit can be easily implemented using two kinds of floating-gate MOS devices whose threshold voltages are controllable. In fact, it is demonstrated that four kinds of threshold voltages in a practical floating-gate MOS device can be easily programmable by appropriately controlling the gate, the drain and the source voltage. Finally, the inference time of the quaternary matching VLSI processor with 256 rules and conflict resolution circuits is estimated at about 360 (ns), and the chip area is reduced to about 30 percent, in comparison with the equivalent binary implementation.

A new multiple-valued current-mode (MVCM) logic circuit using substrate bias control is proposed for low-power VLSI systems at higher clock frequency. Since a multi-level threshold value is represented as a threshold voltage of an MOS transistor, a voltage comparator is realized by a single MOS transistor. As a result, two basic components, a comparator and an output generator in the MVCM logic circuit can be merged into a single MOS differential-pair circuit where the threshold voltages of MOS transistors are controlled by substrate biasing. Moreover, the leakage current is also reduced using substrate bias control. As a typical example of an arithmetic circuit, a radix-2 signed-digit full adder using the proposed circuit is implemented in a 0.18- µm CMOS technology. Its dynamic and static power dissipations are reduced to about 79 percent and 14 percent, respectively, in comparison with those of the corresponding binary CMOS implementation at the supply voltage of 1.8 V and the clock frequency of 500 MHz.

A new logic-in-memory circuit is proposed for a fine-grain pipelined VLSI system. Dynamic-storage elements are distributed over a logic-circuit plane. A functional pass gate is a key component, where a linear summation and threshold function are merged compactly using charge-storage and charge-coupling effect with a DRAM-cell-based circuit structure. The use of dynamic logic based on pass-transistor network using functional pass gates makes it possible to realize any logic circuits compactly with small power dissipation. As a typical example, a 54-bit pipelined multiplier is implemented by using the proposed circuit technology. Its power dissipation and chip area are reduced to about 63 percent and 72 percent, respectively, in comparison with those of a corresponding binary CMOS implementation under 0.35-µm CMOS technology.

This paper presents a multiple-valued logic-in-memory circuit with real-time programmability. The basic component, in which a dynamic storage function and a multiple-valued threshold function are merged, is implemented compactly by using charge storage and capacitive coupling with a DRAM-cell-based circuit structure under a 0.8-µm CMOS technology. The pass-transistor network using these basic components makes it possible to realize any multiple-valued-inputs binary-outputs logic circuits compactly. As a typical example, a fully parallel multiple-valued magnitude comparator is also implemented by using the proposed DRAM-cell-based pass-transistor network. Its execution time and power dissipation are reduced to about 11 percent and 29 percent, respectively, in comparison with those of a corresponding binary implementation. A prototype chip is also fabricated to confirm the basic operation of the proposed DRAM-cell-based logic-in-memory circuit.

Toward the age of ultra-high-density digital ULSI systems, the development of new integrated circuits suitable for an ultimately fine geometry feature size will be an important issue. Resonant-tunneling (RT) diodes and transistors based on quantum effects in deep submicron geometry are such kinds of key devices in the next-generation ULSI systems. From this point of view, there has been considerable interests in RT diodes and transistors as functional devices for circuit applications. Especially, it has been recognized that RT functional devices with multiple peaks in the current-voltage (I-V) characteristic are inherently suitable for implementing multiple-valued circuits such as a multiple-state memory cell. However, very few types of the other multiple-valued logic circuits have been reported so far using RT devices. In this paper, a new multiple-valued programmable logic array (MVPLA) based on RT devices is proposed for the next-generation ULSI-oriented hardware implementation. The proposed MVPLA consists of 3 basic building blocks: a universal literal circuit, an AND circuit and a linear summation circuit. The universal literal circuit can be directly designed by the combination of the RT diodes with one peak in the I-V characteristic, which is programmable by adjusting the width of quantum well in each RT device. The other basic building blocks can be also designed easily using the wired logic or current-mode wired summation. As a result, a highdensity RT-diode-based MVPLA superior to the corresponding binary implementation can be realized. The device-model-based design method proposed in this paper is discussed using static characteristics of typical RT diode models.

Rapid advances in integrated circuit technology based on binary logic have made possible the fabrication of digital circuits or digital VLSI systems with not only a very large number of devices on a single chip or wafer, but also high-speed processing capability. However, the advance of processing speeds and improvement in cost/performance ratio based on conventional binary logic will not always continue unabated in submicron geometry. Submicron integrated circuits can handle multiple-valued signals at high speed rather than binary signals, especially at data communication level because of the reduced interconnections. The use of nonbinary logic or discrete-analog signal processing will not be out of the question if the multiple-valued hardware algorithms are developed for fast parallel operations. Moreover, in VLSI or ULSI processors the delay time due to global communications between functional modules or chips instead of each functional module itself is the most important factors to determine the total performance. Locally computable hardware implementation and new parallel hardware algorithms natural to multiple-valued data representation and circuit technologies are the key properties to develop VLSI processors in submicron geometry. As a result, multiple-valued VLSI processors make it possible to improve the effective chip density together with the processing speed significantly. In this paper, we summarize several potential advantages of multiple-valued VLSI processors in submicron geometry due to great reduction of interconnection and due to the suitability to locally computable hardware implementation, and demonstrate that some examples of special-purpose multiple-valued VLSI processors, which are a signed-digit arithmetic VLSI processor, a residue arithmetic VLSI processor and a matching VLSI processor can achieve higher performance for real-world computing system.

This paper presents highly reliable multiple-valued one-phase signalling for an asynchronous on-chip communication link under process, supply-voltage and temperature variations. New multiple-valued dual-rail encoding, where each code is represented by the minimum set of three values, makes it possible to perform asynchronous communication between modules with just two wires. Since an appropriate current level is individually assigned to the logic value, a sufficient dynamic range between adjacent current signals can be maintained in the proposed multiple-valued current-mode (MVCM) circuit, which improves the robustness against the process variation. Moreover, as the supply-voltage and the temperature variations in smaller dimensions of circuit elements are dominated as the common-mode variation, a local reference voltage signal according to the variations can be adaptively generated to compensate characteristic change of the MVCM-circuit component. As a result, the proposed asynchronous on-chip communication link is correctly operated in the operation range from 1.1 V to 1.4 V of the supply voltage and that from -50 to 75 under the process variation of 3σ. In fact, it is demonstrated by HSPICE simulation in a 0.13-µm CMOS process that the throughput of the proposed circuit is enhanced to 435% in comparison with that of the conventional 4-phase asynchronous communication circuit under a comparable energy dissipation.

This paper introduces open-wire fault-resilient multiple-valued codes for reliable asynchronous point-to-point global communication links. In the proposed encoding, two communication modules assign complementary codewords that change between two valid states without an open-wire fault. Under an open-wire fault, at each module, the codewords don't reach to one of the two valid states and remains as “invalid” states. The detection of the invalid states makes it possible to stop sending wrong codewords caused by an open-wire fault. The detectability of the open-wire fault based on the proposed encoding is proven for m-of-n codes. The proposed code used in the multiple-valued asynchronous global communication link is capable of detecting a single open-wire fault with 3.08-times higher coding efficiency compared with a conventional multiple-valued code used in a triple-modular redundancy (TMR) link that detects an open-wire fault under the same dynamic range of logical values.

This paper presents a 4-valued content-addressable memory (CAM) for fully parallel template-matching operations in real-time cellular logic image processing with fixed templates. A universal literal is essential to perform a multiple-valued template-matching operation. It is decomposed of a pair of a threshold operation in a CAM cell and a logic-value conversion shared by CAM cells in the same column of a CAM cellular array, which makes a CAM cell function simple. Since a threshold operation together with a 4-valued storage element can be designed by using a single floating-gate MOS transistor, a high-density 4-valued universal-literal CAM with a single-transistor cell can be implemented by using a multi-layer interconnection technology. It is demonstrated that the performance of the proposed CAM is much superior to that of conventional CAMs under the same function.

We have developed a long-range asynchronous on-chip data-transmission link based on multiple-valued single-track signaling for a highly reliable asynchronous Network-on-Chip. In the proposed signaling, 1-bit data with control information is represented by using a one-digit multi-level signal, so serial data can be transmitted asynchronously using only a single wire. The small number of wires alleviates the routing complexity of wiring long-range interconnects. The use of current-mode signaling makes it possible to transmit data at high speed without buffers or repeaters over a long interconnect wire because of the low-voltage swing of signaling, and it leads to low-latency data transmission. We achieve a latency of 0.45 ns, a throughput of 1.25 Gbps, and energy dissipation of 0.58 pJ/bit with a 10-mm interconnect wire under a 0.13 µm CMOS technology. This represents an 85% decrease in latency, a 150% increase in throughput, and a 90% decrease in energy dissipation compared to a conventional serial asynchronous data-transmission link.

An energy-efficient nonvolatile FPGA with assuring highly-reliable backup operation using a self-terminated power-gating scheme is proposed. Since the write current is automatically cut off just after the temporal data in the flip-flop is successfully backed up in the nonvolatile device, the amount of write energy can be minimized with no write failure. Moreover, when the backup operation in a particular cluster is completed, power supply of the cluster is immediately turned off, which minimizes standby energy due to leakage current. In fact, the total amount of energy consumption during the backup operation is reduced by 66% in comparison with that of a conventional worst-case-based approach where the long time write current pulse is used for the reliable write.